AMIS-39100 Datasheet, PDF (15/16 Pages) AMI SEMICONDUCTOR – Octal High Side Driver with Protection

AMIS-39100: Octal High Side Driver with Protection
Data Sheet
10.4 Manual Soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat
part of the lead. Contact time must be limited to 10 seconds at up to 300°C.
When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.
Table 13: Soldering Process
Package
Wave
Soldering Method
Re-flow ⁽¹⁾
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC ⁽³⁾, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Not suitable
Not suitable ⁽²⁾
Suitable
Not recommended ⁽³⁾⁽⁴⁾
Not recommended ⁽⁵⁾
Suitable
Suitable
Suitable
Suitable
Suitable
Notes:
1. All SMD packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package,
there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
dry pack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and
as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder
thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a
pitch (e) equal or smaller than 0.65mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a
pitch (e) equal to or smaller than 0.5mm.
11.0 Revision History
Table 14: Revision History
Revision Date
0.1
Various
0.2
June 2006
0.3
January 2007
Description
Initial document
Document formatted into new AMIS template
Update of some values in Tables 1, 2, 3, 6 and 7. Update of explanation in paragraph
8.6: Diagnostics, and paragraph 8.7: SPI Interface.
Update of Figure 8
Added section 10.0: Soldering
AMI Semiconductor – Jan. 07, M-20557-002
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