CS3160 Datasheet, PDF (4/11 Pages) Applied Micro Circuits Corporation – 2.5 Gbps Wide Bandwidth Transimpedance Amplifier

S3160 – 2.5 Gbps Wide Bandwidth Transimpedance Amplifier ^{Revision A – August 12, 2004}
Data Sheet
Figure 3. S3160 Bonding Pad Location
Y-Axis
1.27 mm (Total Die Size)
1.15 mm (Circuit Die Size)
VCC VCC
VCC VCC
11
10
9
8
VCC
12
RBYPASS
13
IIN
14
RBYPASS
15
7
FILT
6
OUTN
5
OUTP
1
2
3
4
(0,0) Circuit Die Size ¹
Total Die Size ²
GND
GND
GND GND
Note: Pad Size is 94 µm X 94 µm. The exposed area of the pad is 80 µm X 80 µm.
Die thickness is 254 µm (10 mils).
X-Axis
1. The circuit die size is the smallest possible size of the die. The lower left-hand corner of the circuit die is the
origin of the xy-coordinate system. Pad coordinates indicated in Table 1 are measured from this origin to the
pad's center.
2. The total die size is the largest possible size of the die. It includes a splicing area around the circuit die. The
actual size of any given die may vary in size from the minimum (circuit die) size to the maximum (total die)
size.
4
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