440SP Datasheet, PDF (1/85 Pages) Applied Micro Circuits Corporation – PowerPC 440SP Embedded Processor

Part Number 440SP
Revision 1.23 - Sept 26, 2006
Data Sheet
PowerPC 440SP Embedded Processor
Features
• PowerPC^‚ 440 processor core operating at up to
667MHz with 32-KB I- and D-caches (with parity
checking)
• On-chip 256-KB SRAM configurable as L2 Cache
or Ethernet Packet/Code store memory
• Selectable Processor:Bus clock ratios (Refer to
the Clocking chapter in the PPC440SP Embedded
Processor User’s Manual for details)
• Supports up to 4 GB (2 Chip Selects) of 64-bit/32-
bit SDRAM with ECC
– DDR1 266-333-400
– DDR2 400-533-667
• Three DDR PCI-X interfaces (32-bit or 64-bit) up
to 133 MHz (DDR 266) with support for
conventional PCI
• XOR Accelerator with DMA controller
• Optional: High throughput RAID 6 hardware
acceleration, performs XOR and Galois Field P &
Q parity computations, supports up to 255 drives
• I2O Messaging Unit with two DMA controllers
• External Peripheral Bus (24-bit Address, 8-bit
Data) for up to three devices
• One Ethernet 10/100/1000 Mbps half- or full-
duplex interface. Operational modes supported
are MII and GMII.
• Programmable Interrupt Controller supports
interrupts from a variety of sources.
• Programmable General Purpose Timers (GPT)
• Three serial ports (16750 compatible UART)
• Two IIC interfaces
• General Purpose I/O (GPIO) interface available
• JTAG interface for board level testing
• Processor can boot from PCI memory
Description
Designed specifically to address high-end embedded
applications for storage, the PowerPC 440SP
Embedded Processor (PPC440SP) provides a high-
performance, low power solution that interfaces to a
wide range of peripherals by incorporating on-chip
power management features and lower power
dissipation.
This chip contains a high-performance RISC
processor core, a DDR2 SDRAM controller,
configurable 256KB SRAM to be used as L2 cache or
software-controlled on-chip memory, three DDR PCI-X
bus interfaces, an Ethernet interface, an I2O/DMA
controller, control for external ROM and peripherals,
optional RAID 6 acceleration, an XOR DMA unit, serial
ports, IIC interfaces, and general purpose I/O.
Technology: CMOS Cu-11, 0.13mm
Package: 29mm, 783-ball, 1mm pitch, Flip Chip-
Plastic Ball Grid Array (FC-PBGA)
Power (estimated): Less than 6W @533MHz
Supply voltages required: 3.3V, 2.5V, 1.8V, 1.5V
AMCC Proprietary
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