DRF1200 Datasheet, PDF (8/8 Pages) Advanced Power Technology – MOSFET Driver Hybrid

DRF1200
Mounting instructions for Flangeless Packages
Heat sink mounting of any device in the Flangeless Package family follows the same
process details outlined in this document.
3
1
Stress Relief
“S” Bend
On all leads
2
T3 Package
4
Torque screws in 1 -2-3-4 Sequence
4-40 Socket head SS Screws .
Torque to 8in.lb.
#4 Flat Washer
PCB
PCB
Thermal Compound
Figure 11, Top and Side View of a T3 device
Heat Sink Surface:
1. The heat sink surface should be smooth, free
of nicks and burs; in addition it should be flat to
≤.001in./in TIR, (Total Indicator Run out) and be
finished to ~ 68µ CLA, (Center Line Average).
2. Must be free of solder balls, metal shavings and
any foreign objects or material.
Stress Relief
“S” Bend
On all leads
PCB
2. The BeO surface of the device must be
free of any foreign objects or material.
3. The BeO surface must be coated with a
thin and uniform film of thermal compound.
4. For commercial manufacturing the
suggested method for thermal compound
application is to apply the compound using
a screen printer. This process insures con-
sistent and repeatable performance with
minimum effort.
Mechanical Attachment:
1. The four screws (1-2-3-4), as shown in
Figure 11, should be installed and seated,
then torqued to one-half the specification,
in the sequence shown. First screw 1 then
screw 2, 3 and 4.
2. Then complete the process by tighten-
ing to the full specification in the same
manner.
3. The torque spec is 8in.lb. ±1lb. (0.9Nm)
Lead Attachment:
1. The leads may now be soldered to the
PCB
2. Maximum lead temperature must not
exceed 300°C for 10s.
3. For lead free use 96.5 % tin, 3% silver,
and 0.5% copper.
4. Non-lead Free use 2% Silver, 62% Tin,
36% lead (sn62).
Figure 12, Stress Relief bend
Device Preparation:
1. The leads should be prepared with an “s” bend, as
shown in Figure 10 prior to mounting on the heat sink