ADSP-21060CZ-160 Datasheet, PDF (50/64 Pages) Analog Devices – SHARC Processor

ADSP-21060/ADSP-21060L/ADSP-21062/ADSP-21062L/ADSP-21060C/ADSP-21060LC
ENVIRONMENTAL CONDITIONS
The ADSP-2106x processors are rated for performance under
T_CASE environmental conditions specified in the Operating Con-
ditions (5 V) on Page 15 and Operating Conditions (3.3 V) on
Page 18.
Thermal Characteristics for MQFP_PQ4 and PBGA
Packages
The ADSP-21060/ADSP-21060L and ADSP-21062/ADSP-
21062L are available in 240-lead thermally enhanced
MQFP_PQ4 and 225-ball plastic ball grid array packages. The
top surface of the thermally enhanced MQFP_PQ4 contains a
metal slug from which most of the die heat is dissipated. The
slug is flush with the top surface of the package. Note that the
metal slug is internally connected to GND through the device
substrate.
Both packages are specified for a case temperature (T_CASE). To
ensure that the T_CASE is not exceeded, a heatsink and/or an air-
flow source may be used. A heatsink should be attached with a
thermal adhesive.
T_CASE = T_AMB + (PD u T_CA)
T_CASE = Case temperature (measured on top surface of package)
PD =Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
T_CA =Value from Table 37 below.
Table 37. Thermal Characteristics for Thermally Enhanced
240-Lead MQFP_PQ4¹
Parameter Airflow (LFM²)
Typical Unit
T_CA
0
T_CA
100
T_CA
200
T_CA
400
T_CA
600
10
°C/W
9
°C/W
8
°C/W
7
°C/W
6
°C/W
1 _{This represents thermal resistance at total power of 5 W. With airflow, no}
variance is seen in T_CA at 5 W.
T_CA at 0 LFM varies with power:
at 2 W, T_CA = 14°C/W
at 3 W, T_CA = 11°C/W
2 _{LFM = Linear feet per minute of airflow.}
Table 38. Thermal Characteristics for BGA
Parameter Airflow (LFM¹)
T_CA
0
T_CA
200
T_CA
400
1 _{LFM = Linear feet per minute of airflow.}
Typical
20.70
15.30
12.90
Unit
°C/W
°C/W
°C/W
Thermal Characteristics for CQFP Package
The ADSP-21060C/ADSP-21060LC are available in 240-lead
thermally enhanced ceramic QFP (CQFP). There are two pack-
age versions, one with a copper/tungsten heat slug on top of the
package (CZ) for air cooling, and one with the heat slug on the
bottom (CW) for cooling through the board. The ADSP-2106x
is specified for a case temperature (T_CASE). To ensure that the
T_CASE data sheet specification is not exceeded, a heatsink and/or
an air flow source may be used. A heatsink should be attached
with a thermal adhesive.
T_CASE = T_AMB + (PD u T_CA)
T_CASE = Case temperature (measured on top surface of package)
PD = Power dissipation in W (this value depends upon the spe-
cific application; a method for calculating PD is shown under
Power Dissipation).
T_CA =Value from Table 38 below.
Table 39. Thermal Characteristics for Thermally Enhanced
240-Lead CQFP¹
Parameter Airflow (LFM²)
Typical Unit
ADSP-21060CW/ADSP-21060LCW
T_CA
0
T_CA
100
T_CA
200
T_CA
400
T_CA
600
ADSP-21060CZ/ADSP-21060LCZ
19.5
°C/W
16
°C/W
14
°C/W
12
°C/W
10
°C/W
T_CA
0
20
°C/W
T_CA
100
16
°C/W
T_CA
200
14
°C/W
T_CA
400
11.5
°C/W
T_CA
600
9.5
°C/W
1 _{This represents thermal resistance at total power of 5 W. With airflow, no}
variance is seen in T_CA at 5W.
T_CA at 0 LFM varies with power.
ADSP-21060CW/ADSP-21060LCW:
at 2 W, T_CA = 23°C/W
at 3 W, T_CA = 21.5°C/W
ADSP-21060CZ/ADSP-21060LCZ:
at 2 W, T_CA = 24°C/W
at 3 W, T_CA = 21.5°C/W
T_JC = 0.24°C/W for all CQFP models.
2 _{LFM = Linear feet per minute of airflow.}
Rev. F | Page 50 of 64 | March 2008