ADSP-TS201S_06 Datasheet, PDF (45/48 Pages) Analog Devices – TigerSHARC-R Embedded Processor

OUTLINE DIMENSIONS
The ADSP-TS201S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
ADSP-TS201S
1.25
1.00
0.75
25.20
25.00
24.80
A1 BALL
INDICATOR
1.25
1.00
0.75
TOP VIEW
3.10
2.94
2.78
25.20
25.00
24.80
DETAIL A
24 22 20 18 16 14 12 10 8 6 4 2
23 21 19 17 15 13 11 9 7 5 3 1
1.00
BSC
23.00
BSC
SQ
1.00
BSC
(BA LL
PITCH)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
1.00
BSC
BOTTOM VIEW
0.97 BSC
1.60 MAX
0.60
0.50
0.40
NOTES:
1. ALL DIMENSIONS ARE IN MILLIMETERS.
2. THE ACTUAL POSITION OF THE BALL GRID IS WITHIN 0.25 mm OF ITS
IDEAL POSITION RELATIVE TO THE PACKAGE EDGES.
3. CENTER DIMENSIONS ARE NOMINAL.
4. THIS PACKAGE C ONFORMS TO JEDEC MS-034 SPECIFICATION.
SEATING PLANE
0.75
0.65
0.55
(BALL
DIAMETER)
0.20 MAX
DETAIL A
Figure 47. 576-Ball BGA_ED (BP-576)
SURFACE MOUNT DESIGN
Table 36 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Table 36. BGA Data for Use with Surface Mount Design
Package
576-Ball BGA_ED
(BP-576)
Ball Attach Type
Nonsolder Mask Defined (NSMD)
Solder Mask Opening
0.69 mm diameter
Ball Pad Size
0.56 mm diameter
Rev. C | Page 45 of 48 | December 2006