OP467 Datasheet, PDF (4/16 Pages) Analog Devices – Quad Precision, High Speed Operational Amplifier

OP467
WAFER TEST LIMITS1
( @ V_S = ؎15.0 V, T_A = +25؇C unless otherwise noted.)
Parameter
Symbol
Conditions
Limit
Units
Offset Voltage
Input Bias Current
Input Offset Current
Input Voltage Range²
Common-Mode Rejection Ratio
Power Supply Rejection Ratio
Large Signal Voltage Gain
Output Voltage Range
Supply Current
V_OS
I_B
I_OS
CMRR
PSRR
A_VO
V_O
I_SY
V_CM = 0 V
V_CM = 0 V
V_CM = ± 12 V
V = ± 4.5 V to ± 18 V
R_L = 2 kΩ
R_L = 2 kΩ
V_O = 0 V, R_L = ∞
± 0.5
600
100
± 12
80
96
83
± 13.0
10
mV max
nA max
nA max
V min/max
dB min
dB min
dB min
V min
mA max
NOTES
1_{Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard}
product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
2_{Guaranteed by CMR test.}
ABSOLUTE MAXIMUM RATINGS¹
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Input Voltage² . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 18 V
Differential Input Voltage² . . . . . . . . . . . . . . . . . . . . . . ± 26 V
Output Short-Circuit Duration . . . . . . . . . . . . . . . . . . Limited
Storage Temperature Range
Y, RC Packages . . . . . . . . . . . . . . . . . . . . –65°C to +175°C
P, S Packages . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
OP467A . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
OP467G . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature Range
Y, RC Packages . . . . . . . . . . . . . . . . . . . . –65°C to +175°C
P, S Packages . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300°C
ORDERING GUIDE
Model
Temperature Package
Ranges
Descriptions
Package
Options
OP467AY/883 –55°C to +125°C 14-Lead Cerdip Q-14
OP467ARC/883 –55°C to +125°C 20-Contact LCC E-20A
OP467GP
–40°C to +85°C 14-Lead Plastic DIP N-14
OP467GS
–40°C to +85°C 16-Lead SOL
R-16
OP467GBC +25°C
DICE
DICE CHARACTERISTICS
Package Type
␪_A3
␪_JC
Units
14-Lead Cerdip (Y)
94
10
°C/W
14-Lead Plastic DIP (P) 76
33
°C/W
16-Lead SOL (S)
88
23
°C/W
20-Contact LCC (RC)
78
33
°C/W
NOTES
1_{Absolute maximum ratings apply to both DICE and packaged parts, unless}
otherwise noted.
2_{For supply voltages less than ± 18 V, the absolute maximum input voltage is equal}
to the supply voltage.
3_{θJA is specified for the worst case conditions, i.e., θJA is specified for device in socket}
for cerdip, P-DIP, and LCC packages; θ_JA is specified for device soldered in circuit
board for SOIC package.
OP467 Die Size 0.111 Ï« 0.100 inch, 11,100 sq. mils Sub-
strate is Connected to V+, Number of Transistors 165.
–4–
REV. C