English
Language : 

ADSP-21160N_15 Datasheet, PDF (16/60 Pages) Analog Devices – SHARC Digital Signal Processor
ADSP-21160M/ADSP-21160N
ELECTRICAL CHARACTERISTICS—ADSP-21160M
Table 6 shows ADSP-21160M electrical characteristics. These
specifications are subject to change without notification.
Table 6. Electrical Characteristics—ADSP-21160M
Parameter
Test Conditions
Min
Max
Unit
VOH
VOL
IIH
IIL
IILPU1
IILPU2
IOZH
IOZL
IOZHPD
IOZLPU1
IOZLPU2
IOZHA
IOZLA
IDD-INPEAK
IDD-INHIGH
IDD-INLOW
IDD-IDLE
AIDD
CIN
High Level Output Voltage1
Low Level Output Voltage1
High Level Input Current3, 4, 5
Low Level Input Current3
Low Level Input Current Pull-Up14
Low Level Input Current Pull-Up25
Three-State Leakage Current6, 7, 8, 9
Three-State Leakage Current6
Three-State Leakage Current Pull-Down9
Three-State Leakage Current Pull-Up17
Three-State Leakage Current Pull-Up28
Three-State Leakage Current10
Three-State Leakage Current10
Supply Current (Internal)11
Supply Current (Internal)12
Supply Current (Internal)13
Supply Current (Idle)14
Supply Current (Analog)15
Input Capacitance16, 17
@ VDDEXT = Min, IOH= –2.0 mA2
@ VDDEXT = Min, IOL = 4.0 mA2
@ VDDEXT = Max, VIN = VDD Max
@ VDDEXT = Max, VIN = 0 V
@ VDDEXT = Max, VIN = 0 V
@ VDDEXT = Max, VIN = 0 V
@ VDDEXT = Max, VIN = VDD Max
@ VDDEXT = Max, VIN = 0 V
@ VDDEXT = Max, VIN = VDD Max
@ VDDEXT = Max, VIN = 0 V
@ VDDEXT = Max, VIN = 0 V
@ VDDEXT = Max, VIN = VDD Max
@ VDDEXT = Max, VIN = 0 V
tCCLK = 12.5 ns, VDDINT = Max
tCCLK = 12.5 ns, VDDINT = Max
tCCLK = 12.5 ns, VDDINT = Max
tCCLK = 12.5 ns, VDDINT = Max
@AVDD= Max
fIN= 1 MHz, TCASE = 25°C, VIN= 2.5 V
2.4
V
0.4
V
10
μA
10
μA
250
μA
500
μA
10
μA
10
μA
250
μA
250
μA
500
μA
25
μA
4
mA
1400
mA
875
mA
625
mA
400
mA
10
mA
4.7
pF
1 Applies to output and bidirectional pins: DATA63–0, ADDR31–0, MS3–0, RDx, WRx, PAGE, CLKOUT, ACK, FLAG3–0, TIMEXP, HBG, REDY, DMAG1, DMAG2, BR6–1,
PA, BRST, CIF, DT0, DT1, TCLK0, TCLK1, RCLK0, RCLK1, TFS0, TFS1, RFS0, RFS1, LxDAT7–0, LxCLK, LxACK, BMS, TDO, and EMU.
2 See Output Drive Currents—ADSP-21160M on Page 47 for typical drive current capabilities.
3 Applies to input pins: SBTS, IRQ2–0, HBR, CS, ID2–0, RPBA, EBOOT, LBOOT, CLKIN, RESET, TCK, and CLK_CFG3-0.
4 Applies to input pins with internal pull-ups: DR0, and DR1.
5 Applies to input pins with internal pull-ups: DMARx, TMS, TDI, and TRST.
6 Applies to three-statable pins: DATA63–0, ADDR31–0, PAGE, CLKOUT, ACK, FLAG3–0, REDY, HBG, BMS, BR6–1, TFSx, RFSx, and TDO.
7 Applies to three-statable pins with internal pull-ups: DTx, TCLKx, RCLKx, and EMU.
8 Applies to three-statable pins with internal pull-ups: MS3–0,RDx, WRx, DMAGx, PA, and CIF.
9 Applies to three-statable pins with internal pull-downs: LxDAT7–0, LxCLK, and LxACK.
10Applies to ACK pulled up internally with 2 k during reset or ID2–0 = 00x.
11The test program used to measure IDD-INPEAK represents worst-case processor operation and is not sustainable under normal application conditions. Actual internal power
measurements made using typical applications are less than specified. For more information, see Power Dissipation on Page 47.
12IDD-INHIGH is a composite average based on a range of high activity code. For more information, see Power Dissipation on Page 47.
13IDD-INLOW is a composite average based on a range of low activity code. For more information, see Power Dissipation on Page 47.
14Idle denotes ADSP-21160M state during execution of IDLE instruction. For more information, see Power Dissipation on Page 47.
15Characterized, but not tested.
16Applies to all signal pins.
17Guaranteed, but not tested.
Rev. C | Page 16 of 60 | February 2013