5005-09NG Datasheet, PDF (26/116 Pages) Aavid, Thermal Division of Boyd Corporation – How to Use This Catalog

SMT Footprints
FIGURE A
Recommended copper heat speader drain pad footprint
Note: The thickness of
the drain pad is variable
depending on the amount
of heat generated by the
SMT device, design limita-
tions and process.
W
L
Part Number
573100
573300
573400
“L”
9.53 (0.375)
14.22 (0.560)
14.22 (0.560)
“W”
13.97 (0.550)
16.26 (0.640)
21.08 (0.830)
FIGURE B
Recommended heat sink solder mask opening
W¹
W²
0.80
(0.030)
L
1.40
(0.060)
Part Number “L”
573100
9.02 (0.355)
573300
13.72 (0.540)
573400
13.72 (0.540)
“W1”
13.46 (0.530)
15.75 (0.620)
20.57 (0.810)
“W2”
8.89 (0.350)
11.18 (0.440)
16.00 (0.630)
FIGURE C
Recommended copper pad size
for heat sink and device mounting footprint
FIGURE D
Recommended copper pad size
for heat sink and device mounting footprint
10.67
(0.420)
15.49
(0.610)
10.41
(0.410)
2.29
(0.090)
For D Pak (TO-263)
15.49
(0.610)
7.62
(0.300)
For MO-184 and SO-10
10.67
(0.420)
16.76
(0.660)
20.32
(0.800)
2.54
(0.100)
2.54
(0.100)
26
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