5005-09NG Datasheet, PDF (112/116 Pages) Aavid, Thermal Division of Boyd Corporation – How to Use This Catalog

Grease & Epoxy
Sil-Free^TM
Sil-Free^TM 1020 is a metal-oxide-filled, silicone-free synthetic grease
specially formulated to enhance heat transfer across the interface
between the semiconductor case and the heat sink without the
migration or contamination associated with silicone-based products.
Dry interface case-to-sink thermal resistance is typically reduced
50% to 75% with proper application of Sil-Free^TM 1020.
This virtually "no-bleed", high-performance compound will not dry
out, harden, melt, or run, even after long-term continuous exposure
to temperatures up to 200°C. Even in a vacuum atmosphere (10-5
Torr, 24 hours@100°C), Sil-Free^TM 1020 exhibits virtually "no bleed"
or evaporation.
ORDERING INFORMATION
Part number
101700F00000G
101800F00000G
101900F00000G
Package
Syringe
Tube
Jar
Size
43 grams (1.5 oz)
57 grams (2.0 oz)
57 grams (2.0 oz)
102000F00000G
102100F00000G
Tube
Jar
143 grams (5.0 oz)
457 grams (16.0 oz)
Ther-O-Link^TM
Ther-O-Link^TM is a silicone-based thermal compound that
cost effectively enhances the heat transfer between a semi-
conductor case and a heat sink. Easy to apply, Ther-O-Link^TM
substantially reduces dry interface thermal resistance, while
providing long life under a variety of conditions.
ORDERING INFORMATION
Part number
Package
Size
100000F00000G Ampule
1 gram (0.03 oz)
100100F00000G Syringe 35.7 grams (1.25 oz)
100200F00000G
Tube
57 grams (2.0 oz)
100500F00000G
Tube
143 grams (5.0 oz)
100800F00000G
Tube
228.6 grams (8.0 oz)
101600F00000G
Can
0.45 kg (1 lb)
108000F00000G
Can
2.27 kg (5 lb)
132000F00000G
Can
9.07 kg (20 lb)
Ultrastick^TM
Aavid's Ultrastick^TM is a unique phase-change thermal inter-
face material that surpasses grease in thermal performance
and long-term stability. This solid, silicone-free, paraffin-
based thermal compound changes phase at 60°C, with a
concurrent volumetric expansion that fills gaps between the
mating surfaces. Ultrastick^TM comes in a convenient applica-
tor bar, allowing for neat, fast application to both heat sink
and component surfaces. One cost-effective application
leaves a thin, film-like deposit, providing excellent heat
transfer and low interface thermal resistance.
ORDERING INFORMATION
Part number
100300F00000G
Package
Bar
Size
47.5 grams (0.16 oz)
PRODUCT INFORMATION
Color
Thermal
conductivity
Operating
temperature range
Volume
Weight
Dielectric strength
Consistency
Bleed
Specific gravity
Shelf life
White
0.79 W/(m-°C)
-40°C to +200°C
10¹² Ohm-cm 2.3 ± 0.5
47.5 grams
225 volts/mil
Paste
0.09 max
% after 24hr @ 200°C
2.8 ± 0.2
Indefinite
(unopened)*
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
PRODUCT INFORMATION
Color
Thermal conductivity
Operating
temperature range
Volume resistivity
Dielectric strength
Consistency
Bleed
Specific gravity
Shelf life
White
0.73 W/(m-°C)
-40°C to +200°C
1.0 x 10¹⁵ Ohm-cm
250 volts/mil
Paste
0.6 max
2.8
Indefinite (unopened)*
* It is recommended that the containers be turned over
every 6 months to minimize settling for ease of mixing
PRODUCT INFORMATION
Temperature range
Volume resistivity
Dielectric strength
Consistency
Bleed
Specific gravity
Color
Thermal resistance
Shelf life
-40°C to +200°C
1.0 X 1.0¹⁵ Ohm-cm
250 volts/mil
Paste
0.6 max
0.28
Opaque White
0.03°C/W per square inch @ 20 psi
0.02°C/W per square inch @ 100 psi
Indefinite*
* Recommended max. storage temperature: 40ºC (105ºF)
112
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