5005-09NG Datasheet, PDF (107/116 Pages) Aavid, Thermal Division of Boyd Corporation – How to Use This Catalog

Mounting Pads
FEATURES
• Prevent heat damage during soldering
• Facilitate board clean-up
• Prevent solder bridges
• Assure uniform device height
PRODUCT INFORMATION
Suffix
Base material
MAXIMUM OPERATING TEMPERATURE
Continuous
Deflection
Color
NG
Nylon base resin
per ASTM STD
D4066-82-PA111
121.0°C 250°F
243.3°C 470°F
Natural
DAPG*
Diallyl Phthalate
per MIL-M-14G
type SDG
204.4°C 400°F
282.2°C 540°F
Black only
* All “DAP” mounting pads meet UL 94 V-0
Note: Please specify material for each mounting pad: “N” = nylon; “DAP” = Diallyl Phtalate.
Example: 7717-3NG, 7717-86DAPG
Index of Semiconductor Lead Conversion Pads
ORDERING INFORMATION
Part number
7717-130G
7717-247G
7717-26G
7717-44G
Converts lead
spacing from
To
# of Leads
For epoxy transistors
0.05 In-Line TO-92 & TO-15
3
For TO-18
TO-18
TO-5
3
TO-18
TO-5
3
TO-18
TO-5
4
See pages 108 and 109 for mechanical drawings
Outside dia
5.84 (0.230)
7.11 (0.280)
8.71 (0.343)
7.75 (0.305)
Thickness
1.02 (0.040)
3.81 (0.170)
3.05 (0.120)
3.18 (0.125)
Index of Semiconductor Mounting Pads
ORDERING INFORMATION
Part number Leads
Outside dia
For TO-5
7717-86G
3
7717-178G
3
7717-79G
3
7717-3G
3–4
7717-15G
4
7717-5G
4
7717-4G
4
8.71 (0.343)
8.89 (0.350)
9.02 (0.355)
8.64 (0.340)
8.89 (0.350)
8.89 (0.350)
9.53 (0.375)
For TO-18
7717-16G
7717-18G
7717-108G
7717-89G
7717-7G
4
5.08 (0.200)
4
5.08 (0.200)
4
5.16 (0.203)
4
6.35 (0.250)
4
6.35 (0.250)
For integrated circuits
7717-122G
7717-8G
7717-156G
8
9.27 (0.365)
8
9.53 (0.375)
14
19.05 x 11.43 (0.750 x 0.450)
Misc. mounting pads
7717-175G Crystal Can Relay 10.16 / 20.32 (0.400 x 0.800)
Thickness
1.91 (0.075)
0 .53 (0.021)
0.97 (0.038)
1.91 (0.075)
0.51 (0.020)
3.18 (0.125)
1.91 (0.075)
0.51 (0.020)
2.54 (0.100)
1.78 (0.070)
2.03 (0.080)
3.18 (0.125)
1.78 (0.070)
1.91 (0.075)
1.27 (0.050)
1.27 (0.050)
See pages 108 and 109 for mechanical drawings
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