W39F010 Datasheet, PDF (12/33 Pages) Winbond – 128K × 8 CMOS FLASH MEMORY

W39F010
7. TABLE OF OPERATING MODES
7.1 Device Bus Operations
MODE
Read
Write
Standby
Write Inhibit
Output Disable
#CE
VIL
VIL
VIH
X
X
VIL
#OE
VIL
VIH
X
VIL
X
VIH
PIN
#WE
VIH
VIL
X
X
VIH
VIH
DQ0 − DQ7
Dout
Din
High Z
High Z/Dout
High Z/Dout
High Z
7.2 Command Definitions
COMMAND
Description
NO. OF 1ST CYCLE 2ND CYCLE 3RD CYCLE 4TH CYCLE 5TH CYCLE 6TH CYCLE 7TH CYCLE
Cycles Addr. ⁽¹⁾Data Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data Addr. Data
Read
Chip Erase
Page Erase
1
A_IN D_OUT
6
5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 10
6
5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 PA⁽³⁾ 50
Byte Program
4
5555 AA 2AAA 55 5555 A0 A_IN D_IN
Top Boot Block
Lockout –16KByte
6
5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 70
1FFFF
XX⁽⁴⁾
Bottom Boot Block
Lockout - 16KByte
6
5555 AA 2AAA 55 5555 80 5555 AA 2AAA 55 5555 70
00000
XX⁽⁴⁾
Product ID Entry
Product ID Exit ⁽²⁾
Product ID Exit ⁽²⁾
3
5555 AA 2AAA 55 5555 90
3
5555 AA 2AAA 55 5555 F0
1
XXXX F0
Notes:
1. Address Format: A14 − A0 (Hex); Data Format: DQ7 − DQ0 (Hex)
2. Either one of the two Product ID Exit commands can be used.
3. PA: Page Address
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