1563626 Datasheet, PDF (8/9 Pages) YAGEO Corporation – GENERAL PURPOSE CHIP RESISTORS

Chip Resistor Surface Mount ^{RC SERIES 0201}
Product specification 8
9
TEST
Humidity
TEST METHOD
IEC 60115-1 4.21
Intermittent
Overload
IEC 60115-1 4.39
PROCEDURE
Steady state for 1000 hours at 40 °C / 95%
R.H. RCWV applied for 1.5 hours on and
0.5 hour off
REQUIREMENTS
±(1.0%+0.05 Ω)
for 1%, 0.5% tol.
±(2.0%+0.05 Ω)
for 5% tol.
<100 mΩ for Jumper
2.5 times of rated voltage or maximum
overload voltage whichever is less for 1 second
on and 25 seconds off; total 10,000 cycles
±(1.0%+0.05 Ω)
for 1%, 0.5% tol.
±(2.0%+0.05 Ω)
for 5% tol.
<100 mΩ for Jumper
Solderability
- Wetting
IPC/JEDEC J-STD-002B test B
Electrical Test not required
Magnification 50X
SMD conditions:
1^st step: method B, aging 4 hours at 155 °C
dry heat
2^nd step: lead-free solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Well tinned (≥95% covered)
No visible damage
- Leaching
IPC/JEDEC J-STD-002B test D Lead-free solder, 260 °C, 30 seconds
immersion time
- Resistance to IEC 60068-2-58
Soldering Heat
Condition B, no pre-heat of samples
Lead-free solder, 260 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
No visible damage
±(0.5%+0.05 Ω)
for 1%, 0.5% tol.
±(1.0%+0.05 Ω)
for 5% tol.
<50 mΩ for Jumper
No visible damage
May 02, 2011 V.8
www.yageo.com