YC102-FR-070RL Datasheet, PDF (11/12 Pages) YAGEO Corporation – ARRAY CHIP RESISTORS

Chip Resistor Surface Mount ^{YC/TC SERIES 102 to 358}
Product specification 11
12
TEST
Solderability
- Wetting
TEST METHOD
IPC/JEDECJ-STD-002B test B
IEC 60068-2-58
PROCEDURE
REQUIREMENTS
Electrical Test not required
Magnification 50X
SMD conditions:
1^st step: method B, aging 4 hours at 155 °C
dry heat
2^nd step: leadfree solder bath at 245± 3 °C
Dipping time: 3± 0.5 seconds
Well tinned (≥95% covered)
No visible damage
- Leaching
IPC/JEDECJ-STD-002B test D
IEC 60068-2-58
Leadfree solder, 260 °C, 30 seconds
immersion time
- Resistance to
Soldering Heat
MIL-STD-202G-method 210F
IEC 60068-2-58
Condition B, no pre-heat of samples
Leadfree solder, 270 °C, 10 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
No visible damage
± (1%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Feb. 16, 2017 V.5
www.yageo.com