YC102-FR-070RL Datasheet, PDF (10/12 Pages) YAGEO Corporation – ARRAY CHIP RESISTORS

Chip Resistor Surface Mount ^{YC/TC SERIES 102 to 358}
Product specification 10
12
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
Life/
Operational Life/
Endurance
TEST METHOD
MIL-STD-202G-method 108A
IEC 60115-1 4.25.1
JIS C 5202-7.10
PROCEDURE
1,000 hours at 70± 5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
REQUIREMENTS
± (2%+0.05 Ω)
<100 mΩ for Jumper
High Temperature
Exposure/
Endurance at
Upper Category
Temperature
MIL-STD-202G-method 108A
IEC 60115-1 4.25.3
JIS C 5202-7.11
1,000 hours at maximum operating
temperature depending on specification,
unpowered
No direct impingement of forced air to the
parts
Tolerances: 125± 3 °C
± (1%+0.05 Ω)
<50 mΩ for Jumper
Moisture
Resistance
MIL-STD-202G-method 106F
IEC 60115-1 4.24.2
Each temperature / humidity cycle is defined at
8 hours (method 106F), 3 cycles / 24 hours for
10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24± 2 hours after
test conclusion
± (2%+0.05 Ω)
<100 mΩ for Jumper
Thermal Shock
MIL-STD-202G-method 107G
-55/+125 °C
Note: Number of cycles required is 300.
Devices mounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
± (1%+0.05 Ω)
<50 mΩ for Jumper
Short Time
Overload
MIL-R-55342D-para 4.7.5
IEC60115-1 4.13
2.5 times RCWV or maximum overload
voltage whichever is less for 5 sec at room
temperature
± (2%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Board Flex/
Bending
IEC60115-1 4.33
Device mounted on PCB test board as
described, only 1 board bending required
3 mm bending
Bending time: 60± 5 seconds
Ohmic value checked during bending
± (1%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Feb. 16, 2017 V.5
www.yageo.com