AC0201DR-071R Datasheet, PDF (10/12 Pages) YAGEO Corporation – THICK FILM CHIP RESISTORS AUTOMOTIVE GRADE

Chip Resistor Surface Mount ^{AC SERIES 0201 to 2512}
Product specification 10
12
TEST
Solderability
- Wetting
TEST METHOD
AEC-Q200 Test 18
J-STD-002
PROCEDURE
Electrical Test not required Magnification 50X
SMD conditions:
(a) Method B, aging 4 hours at 155 °C dry heat,
dipping at 235± 3 °C for 5± 0.5 seconds.
(b) Method B, steam aging 8 hours, dipping at
215± 3 °C for 5± 0.5 seconds.
(c) Method D, steam aging 8 hours, dipping at
260± 3 °C for 7± 0.5 seconds.
REQUIREMENTS
Well tinned (≥95% covered)
No visible damage
Board Flex
AEC-Q200 Test 21
AEC-Q200-005
Chips mounted on a 90mm glass epoxy resin
PCB (FR4)
Bending for 0201/0402: 5 mm
0603/0805: 3 mm
1206 and above: 2 mm
Holding time: minimum 60 seconds
± (1.0%+0.05Ω)
<50 mΩ for Jumper
Temperature
Coefficient of
Resistance (T.C.R.)
MIL-STD-202 Method 304
At +25/–55 °C and +25/+125 °C
Refer to table 2
Formula:
R₂–R₁
T.C.R= ----R---₁--(--t-₂--_–---t-₁--)----- × 10⁶ (ppm/°C)
Where
t₁=+25 °C or specified room temperature
t₂=–55 °C or +125 °C test temperature
R₁=resistance at reference temperature in ohms
R₂=resistance at test temperature in ohms
Short Time
Overload
IEC60115-1 4.13
FOS
ASTM-B-809-95
2.5 times of rated voltage or maximum
overload voltage whichever is less for 5 sec
at room temperature
± (1.0%+0.05Ω) for D/F tol
± (2.0%+0.05Ω) for J tol
<50 mΩ for Jumper
Sulfur (saturated vapor) 500 hours, 60± 2℃,
unpowered
± ( 1.0%+0.05Ω)
Nov. 02, 2016 V.5
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