XC2V40_1 Datasheet, PDF (316/318 Pages) Xilinx, Inc – Industry First Platform FPGA Solution

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Virtex-II Platform FPGAs: Pinout Information
BF957 Flip-Chip BGA Package Specifications (1.27mm pitch)
Figure 10: BF957 Flip-Chip BGA Package Specifications
DS031-4 (v3.5) November 5, 2007
Product Specification
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Module 4 of 4
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