XC2V40_1 Datasheet, PDF (1/318 Pages) Xilinx, Inc – Industry First Platform FPGA Solution

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DS031 (v3.5) November 5, 2007
Module 1:
Introduction and Overview
7 pages
• Summary of Features
• General Description
• Architecture
• Device/Package Combinations and Maximum I/O
• Ordering Examples
Module 2:
Functional Description
41 pages
• Detailed Description
- Input/Output Blocks (IOBs)
- Digitally Controlled Impedance (DCI)
- Configurable Logic Blocks (CLBs)
- 18-Kb Block SelectRAM™ Resources
- 18-Bit x 18-Bit Multipliers
- Global Clock Multiplexer Buffers
- Digital Clock Manager (DCM)
• Routing
• Creating a Design
• Configuration
Virtex-II Platform FPGAs:
Complete Data Sheet
Product Specification
Module 3:
DC and Switching Characteristics
43 pages
• Electrical Characteristics
• Performance Characteristics
• Switching Characteristics
• Pin-to-Pin Output Parameter Guidelines
• Pin-to-Pin Input Parameter Guidelines
• DCM Timing Parameters
• Source-Synchronous Switching Characteristics
Module 4:
Pinout Information
226 pages
• Pin Definitions
• Pinout Tables
- CS144/CSG144 Chip-Scale BGA Package
- FG256/FGG256 Fine-Pitch BGA Package
- FG456/FGG456 Fine-Pitch BGA Package
- FG676/FGG676 Fine-Pitch BGA Package
- BG575/BGG575 Standard BGA Package
- BG728/BGG728 Standard BGA Package
- FF896 Flip-Chip Fine-Pitch BGA Package
- FF1152 Flip-Chip Fine-Pitch BGA Package
- FF1517 Flip-Chip Fine-Pitch BGA Package
- BF957Flip-Chip BGA Package
IMPORTANT NOTE: Page, figure, and table numbers begin at 1 for each module, and each module has its own Revision
History at the end. Use the PDF "Bookmarks" pane for easy navigation in this volume.
© 2000–2007 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other
trademarks are the property of their respective owners.
DS031 (v3.5) November 5, 2007
www.xilinx.com
Product Specification
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