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X1240 Datasheet, PDF (13/19 Pages) Xicor Inc. – Real Time Clock/Calendar with EEPROM
X1240
ABSOLUTE MAXIMUM RATINGS
Temperature Under Bias .................. -65˚C to +135˚C
Storage Temperature ....................... -65˚C to +150˚C
Voltage on any pin with respect to ground-1.0V to 7.0V
DC Output Current .............................................5 mA
Lead Temperature (Soldering, 10 Seconds) .... 300˚C
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and the functional operation
of the device at these or any other conditions above
those indicated in the operational sections of this
specification is not implied. Exposure to absolute max-
imum rating conditions for extended periods may
affect device reliability.
DC OPERATING CHARACTERISTICS (Temperature = -40°c to +85°c, unless otherwise stated.)
Symbol
Vcc
VBACK
VCB
VBC
ICC1
Parameter
Main Power Supply
Backup Power Supply
Switch to Backup Supply
Switch to Main Supply
Read Active Supply Current
ICC2
Program Supply Current
(nonvolatile)
ICC3
Main Timekeeping Current
IBACK1 Backup Timekeeping Current
IBACK2
ILI
ILO
VIL
Backup Supply Current
(External crystal network)
Input Leakage Current
Output Leakage Current
Input LOW Voltage
VCC =
VCC =
VCC = 2.7V
VCC = 3.6V
VCC = 2.7V
VCC = 3.6V
VCC = 2.7V
VCC = 3.6V
VBACK = 1.8V
VBACK = 3.6V
VBACK = 1.8V
VBACK = 3.6V
Min
Typ
2.7
1.8
VBACK -0.2
VBACK
1.6
7.5
-0.5
VIH
VHYS
VOL
VOH
Input HIGH Voltage
Schmitt Trigger Input
Hysteresis
Output LOW Voltage
Output HIGH Voltage
Vcc related level
VCC = 2.7V
VCC = 3.6V
VCC = 2.7V
VCC = 3.6V
VCC x 0.7 or
VBACK x 0.7
.05 x VCC or
.05 x VBACK
1.6
2.4
Max
Unit
Notes
3.6
V
3.6
V
VBACK -0.1
V
(17)
VBACK +0.1
V
(17)
400
µA (5), (8), (15)
800
µA
1.5
mA (5), (8), (16), (17)
3.0
mA
1.7
µA (5), (7), (16), (17)
1.5
µA
1.0
µA (7), (10), (16),
1.5
µA
(17)
3
µA (7), (10), (16),
10
µA
(17)
10
µA
(11)
10
µA
(11)
VCC x 0.2 or V
VBACK x 0.2
VCC + 0.5
V
VBACK + 0.5
V
(5), (14)
(5), (14)
(14)
0.4
V
(12)
0.4
V
(13)
Notes: (1) The device enters the Active state after any start, and remains active: for 9 clock cycles if the Device Select Bits in the Slave
AddressByte are incorrect or until 200nS after a stop ending a read or write operation.
(2) The device enters the Program state 200nS after a stop ending a write operation and continues for tWC.
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