WM8950 Datasheet, PDF (51/52 Pages) Wolfson Microelectronics plc – ADC WITH MICROPHONE INPUT AND PROGRAMMABLE DIGITAL FILTERS

Preliminary Technical Data
PACKAGE DIAGRAM
FL: 24 PIN QFN PLASTIC PACKAGE 4 X 4 X 0.9 mm BODY, 0.50 mm LEAD PITCH
D2
19
24
DETAIL 1
18
A
EXPOSED
GROUND 6
PADDLE
1
E2
SEE DETAIL 2
13
6
12
7
e
BOTTOM VIEW
b1
bbbM C A B
4 INDEX AREA
(D/2 X E/2)
2X
aaa C
2X
aaa C
D
TOP VIEW
DM035.C
E
A3
C
SEATING PLANE
SIDE VIEW
ccc C
A
0.08 C 5
A1
DETAIL 2
A3
b
Exposed lead
W
T
H
G
Half etch tie bar
DETAIL 2
DETAIL 1
0.32mm
45
degrees
EXPOSED
GROUND
PADDLE
DETAIL 2
L
L1
Datum
R
Terminal
tip
e/2
e
Symbols
A
A1
A3
b
D
D2
E
E2
e
G
H
L
L1
T
W
aaa
bbb
ccc
REF:
MIN
0.80
0
0.18
2.00
2.00
0.30
0.03
Dimensions (mm)
NOM
MAX
NOTE
0.90
1.00
0.02
0.05
0.20 REF
0.25
0.30
1
4.00
2.15
2.25
2
4.00
2.15
2.25
2
0.50 BSC
0.213
0.1
0.40
0.50
0.15
7
0.1
0.2
Tolerances of Form and Position
0.15
0.10
0.10
JEDEC, MO-220, VARIATION VGGD-2.
NOTES:
1. DIMENSION b APPLIES TO METALLIZED TERMINAL AND IS MEASURED BETWEEN 0.15 mm AND 0.30 mm FROM TERMINAL TIP.
2. FALLS WITHIN JEDEC, MO-220, VARIATION VGGD-2.
3. ALL DIMENSIONS ARE IN MILLIMETRES.
4. THE TERMINAL #1 IDENTIFIER AND TERMINAL NUMBERING CONVENTION SHALL CONFORM TO JEDEC 95-1 SPP-002.
5. COPLANARITY APPLIES TO THE EXPOSED HEAT SINK SLUG AS WELL AS THE TERMINALS.
6. REFER TO APPLICATIONS NOTE WAN_0118 FOR FURTHER INFORMATION REGARDING PCB FOOTPRINTS AND QFN PACKAGE SOLDERING.
7. DEPENDING ON THE METHOD OF LEAD TERMINATION AT THE EDGE OF THE PACKAGE, PULL BACK (L1) MAY BE PRESENT.
8. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
WM8950
w
PTD Rev 2.1 June 2005
51