FH101_07 Datasheet, PDF (7/7 Pages) WJ Communication. Inc. – High Dynamic Range FET

FH101
High Dynamic Range FET
FH101-G Mechanical Information
This package is lead-free/Green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260qC reflow temperature) and leaded (maximum 245qC reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Product Marking
The FH101-G will be marked with an “FH1G”
designator. An alphanumeric lot code
(“XXXX-X”) is also marked below the part
designator on the top surface of the package. A
“1” will be lasermarked in the upper right-hand
corner. The obsolete tin-lead package is
marked with an “FH1” designator followed by
an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
 ^{ESD Rating: Class 1B}
Value:
Passes 500V to <1000V
Test:
Human Body Model (HBM)
Standard: JEDEC Standard JESD22-A114
 ^{ESD Rating: Class IV}
Value:
Passes 1000V to <2000V
Test:
Charged Device Model (CDM)
Standard: JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260q C convection reflow
Standard: JEDEC Standard J-STD-020
Thermal Specifications
Parameter
Rating
Operating Case Temperature
Thermal Resistance, Rth ⁽¹⁾
Junction Temperature, Tj ⁽²⁾
-40 to +85qC
59 qC / W
126 qC
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 140 mA at an 85 qC case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 qC.
1000
100
10
1
60
MTTF vs. GND Tab Temperature
70 80 90 100
Tab Temperature (°C)
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
110 ^{7. All dimensions are in millimeters (inches). Angles are in degrees.}
Specifications and information are subject to change without notice.
WJ Communications, Inc x Phone 1-800-WJ1-4401 x FAX: [phone] x e-mail: [e-mail] x Web site: www.wj.com
Page 7 of 7 April 2007