W24L01 Datasheet, PDF (9/11 Pages) Winbond – 128K X 8 CMOS STATIC RAM

W24L01
PACKAGE DIMENSIONS
32-pin Small Type One TSOP
HD
D
1
e
b
θ
L
L1
c
E
A2
A
A1
Y
Dimension in Inches Dimension in mm
Symbol
Min. Nom. Max. Min. Nom. Max.
A
0.049
1.25
A 1 0.002
0.006 0.05
0.15
A 2 0.037 0.039 0.041 0.95 1.00 1.05
b 0.007 0.008 0.009 0.17 0.20 0.27
c _{0.0056 0.0059 0.0062 0.14 0.15 0.16}
D 0.461 0.465 0.469 11.70 11.80 11.90
E 0.311 0.315 0.319 7.90 8.00 8.10
HD 0.520 0.528 0.536 13.20 13.40 13.60
e
0.020
0.50
L 0.012 0.020 0.028 _0.30 0.50 0.70
L 1 0.027
0.675
Y 0.000
0.004 0.00
0.10
θ
0
35
0
3
5
Controlling dimension: Millimeters
32-pin SOP Wide Body
32
17
E HE
1
b ¹⁶
D
S
y
Seating Plane
A2 ^A
e
A1
e1
θ
L
Detail F
e1
c
LE
See Detail F
Symbol
A
A1
A2
b
c
D
E
e
HE
L
LE
S
y
θ
Dimension in Inches
Min. Nom. Max.
0.118
Dimension in mm
Min. Nom. Max.
3.00
0.004
0.10
0.101 0.106 0.111 2.57 2.69 2.82
0.014 0.016 0.020 0.36 0.41 0.51
0.006 0.008
0.805
0.012
0.817
0.15
0.20
20.45
0.31
20.75
0.440 0.445 0.450 11.18 11.30 11.43
0.044 0.050 0.056 1.12 1.27 1.42
0.546 0.556 0.556 13.87 14.12 14.38
0.023 0.031 0.039 0.58 0.79 0.99
0.047 0.055 0.063 1.19 1.40 1.60
0.036
0.91
0.004
0.10
0
10
0
10
Notes:
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3.
Dimensions D & E
and determined at
ti.nhcelumdoeldmpoaldrtimngislminaet.ch
4. Controlling dimension: Inches
5. General appearance spec should be based
on final visual inspection spec.
Publication Release Date: January 2, 2002
-9-
Revision A6