I5216 Datasheet, PDF (81/83 Pages) Winbond – 8 TO 16 MINUTE VOICE RECORD/PLAYBACK SYSTEM WITH INTEGRATED CODEC

I5216 SERIES
Advanced Information
PRELIMINARY
I5216 SERIES BONDING PHYSICAL LAYOUT ⁽¹⁾ (UNPACKAGED DIE)
V_SSD V_SSD A0 SDA A1 SCL V_CCD V_CCD MCLK INT RAC SDIO SDI V_SSA
I5216 Series
Die Dimensions
I5216 Series
X:_D4_ie3_D8_i0_meµ_nm_sions
Y: 988X0: µ43m80µm
Die Thickn_De_iess_T⁽_hY³_i^):c9kn8e8s0(_s^µ3)^m
29_P2_a._d1 ²Âµ⁹m^2.1O+^µ_pm1_e2_n+i._n7^1g2µ^.7m^µm
Pad Opening (⁹m⁰i^xn)^90µm
3.5 x 3.5 mils
90x 90 µm
3.5 x 3.5 mils
I5216
V_SSA MIC+ MIC - MICBS ACAP
SP-
V_SSA(2) SP+ V_CCA(2) AUXIN AUXOUT SCK WS
1.
The backside of die is internally connected to Vss. It MUST NOT be connected to any other
potential or damage may occur.
2.
Double bond recommended.
This figure reflects the current die thickness. Please contact Winbond as this thickness may change
in the future.
Publication Release Date: November 30, 2001
- 81
Revision A1