W2465A Datasheet, PDF (8/9 Pages) Winbond – 8K X 8 High Speed CMOS Static RAM

W2465A
PACKAGE DIMENSIONS
28-pin P-DIP Skinny
D
28
15
1
E
1
14
S
2
AA
L
B
e1
B1
1
A
Base Plane
E
c
Mounting Plane
a
eA
Symbol
Dimension in Inches Dimension in mm
Min. Nom. Max. Min. Nom. Max.
A
0.175
4.45
A1
0.010
0.25
A2
0.125 0.130 0.135 3.18 3.30 3.43
B
0.016 0.018 0.022 0.41 0.46 0.56
B1
0.058 0.060 0.064 1.47 1.52 1.63
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.388 1.400
35.26 35.56
E
0.300 0.310 0.320 7.62 7.87 8.13
E1
0.283 0.288 0.293 7.19 7.32 7.44
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0°
15°
0°
15°
eA
0.330 0.350 0.370 8.38 8.89 9.40
S
0.055
1.40
Notes:
1. Dimension D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
28-pin Small Outline J Band
28
15
E
E
H
1
14
D
s
b
b1
e
Seating Plane
c
2
AA
L
0
1
A
e1
y
Symbol ^{Dimension in Inches Dimension in mm}
Min. Nom. Max. Min. Nom. Max.
A
0.140
3.56
A1
0.027
0.69
A2
0.095 0.100 0.105 2.41 2.54 2.67
b1
0.026 0.028 0.032 0.66 0.71 0.81
b
0.016 0.018 0.022 0.41 0.46 0.56
c
0.008 0.010 0.014 0.20 0.25 0.36
D
0.710 0.730
18.03 18.54
E
0.295 0.300 0.305 7.49 7.62 7.75
e
0.044 0.050 0.056 1.12 1.27 1.42
e1
0.245 0.265 0.285 6.22 6.73 7.24
HE
0.327 0.337 0.347 8.31 8.56 8.81
L
0.077 0.087 0.097 1.96 2.21 2.46
S
0.045
1.14
y
0.004
0.10
0
0
10
0
10
Notes:
1. Dimension D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimension D & E include mold mismatch
and are determined at the mold parting line.
4. Controlling dimension: Inches.
5. General appearance spec. should be based
on final visual inspection spec.
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