W24256 Datasheet, PDF (8/10 Pages) Winbond – 32K X 8 CMOS STATIC RAM

Preliminary W24256
PACKAGE DIMENSIONS
28-pin P-DIP
28
E1
1
S
A A2
L
D
15
B
e1
B1
14
E
A1 _{Base Plane}
Seating Plane
a
eA
Dimension in Inches Dimension in mm
Symbol _{Min. Nom. Max. Min. Nom. Max.}
A
0.210
5.33
A 1 ^0.010
0.25
A2
0.150 0.155 0.160 3.81 3.94 4.06
B
0.016 0.018 0.022 0.41 0.46 0.56
B1
0.058 0.060 0.064 1.47 1.52 1.63
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.460 1.470
37.08 37.34
E
0.590 0.600 0.610 14.99 15.24 15.49
E1
0.540 0.545 0.550 13.72 13.84 13.97
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.02
S
0.090
2.29
Notes:
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
c
3. Dimensions D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion..
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
28-pin SOP Wide Body
28
15
e1
E HE
θ
L
Detail F
1
14
b
D
A2 A
S
e
y
A1
Seating Plane
e1
c
LE
See Detail F
Dimension in Inches Dimension in mm
Symbol _{Min. Nom. Max. Min. Nom. Max.}
A
0.112
2.85
A1
0.004
0.10
A2
0.093 0.098 0.103 2.36 2.49 2.62
b
0.014 0.016 0.020 0.36 0.41 0.51
c
0.008 0.010 0.014 0.20 0.25 0.36
D
0.713 0.733
18.11 18.62
E
0.326 0.331 0.336 8.28 8.41 8.53
e
0.044 0.050 0.056 1.12 1.27 1.42
HE
0.453 0.465 0.477 11.51 11.81 12.12
L
0.028 0.036 0.044 0.71 0.91 1.12
LE
0.059 0.067 0.075 1.50 1.70 1.91
S
0.047
1.19
y
0.004
0.10
θ
0
10
0
10
Notes:
1. Dimensions D Max. & S include mold flash
or tie bar burrs.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Dimensions D & E in. clude mold mismatch
and determined at the mold parting line.
4. Controlling dimension: Inches.
5. General appearance spec should be based
on final visual inspection spec.
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