W25Q32BV Datasheet, PDF (79/79 Pages) Winbond – 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q32BV
11. REVISION HISTORY
VERSION
A
DATE
03/26/09
B
08/20/09
C
09/24/09
D
11/05/09
E
07/08/10
F
04/01/11
PAGE
5~8, 45, 46,
65~71
53
5,7,9,67,72,73
51
55
74
63 & 64
64
66-67
69-74
5, 10, 21, 56-58
5, 75 & 76
9, 76-78, 23-69,
47
57-59
DESCRIPTION
New Create Preliminary
Removed SOIC-8 150-mil in Ordering Section.
Removed PDIP-8 300-mil Package
Added WSON-8 8x6-mm Package
Updated package diagram
Updated Suspend/Resume description
Updated UID waveform
Added PDIP-8 300-mil Package
Corrected Read Manufacturer / Device ID diagram
Corrected Read JEDEC ID diagram
Removed Preliminary designator
Updated AC/DC parameters
Updated VIL/VIH
Updated AC/DC parameters
Updated Package Diagrams
Added SFDP feature
Added automotive temperature
Added TFBGA package
Updated diagrams
Added /WP timing diagram
Updated Suspend description
Updated SFDP to JEDEC 1.0
Trademarks
Winbond and SpiFlash are trademarks of Winbond Electronics Corporation.
All other marks are the property of their respective owner.
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems
or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship
instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for
other applications intended to support or sustain life. Further more, Winbond products are not intended for
applications wherein failure of Winbond products could result or lead to a situation wherein personal injury,
death or severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify Winbond for any damages resulting from such improper use or sales.
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Publication Release Date: April 01, 2011
Revision F