W25Q32BV Datasheet, PDF (78/79 Pages) Winbond – 3V 32M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q32BV
10.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q32BV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-digit
Product Number for ordering. However, due to limited space, the Top Side Marking on all packages use
an abbreviated 10-digit number.
Part Numbers for Industrial Temperature:
PACKAGE TYPE
SS
SOIC-8 208mil
SF
SOIC-16 300mil
DA
PDIP-8 300mil
ZP⁽¹⁾
WSON-8 6x5mm
ZE⁽¹⁾⁽²⁾
WSON-8 8x6mm
TC
TFBGA-24 8x6mm
DENSITY
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
PRODUCT NUMBER
W25Q32BVSSIG
W25Q32BVSSIP
W25Q32BVSFIG
W25Q32BVSFIP
W25Q32BVDAIG
W25Q32BVDAIP
W25Q32BVZPIG
W25Q32BVZPIP
W25Q32BVZEIG
W25Q32BVZEIP
W25Q32BVTCIG
W25Q32BVTCIP
TOP SIDE MARKING
25Q32BVSIG
25Q32BVSIP
25Q32BVFIG
25Q32BVFIP
25Q32BVAIG
25Q32BVAIP
25Q32BVIG
25Q32BVIP
25Q32BVIG
25Q32BVIP
25Q32BVCIG
25Q32BVCIP
Part Numbers for Automotive Temperature⁽³⁾:
PACKAGE TYPE DENSITY
PRODUCT NUMBER
TOP SIDE MARKING
SS
SOIC-8 208mil
SF
SOIC-16 300mil
DA
PDIP-8 300mil
ZP⁽¹⁾
WSON-8 6x5mm
ZE⁽¹⁾⁽²⁾
WSON-8 8x6mm
TC
TFBGA-24 8x6mm
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
32M-bit
W25Q32BVSSAG
W25Q32BVSSAP
W25Q32BVSFAG
W25Q32BVSFAP
W25Q32BVDAAG
W25Q32BVDAAP
W25Q32BVZPAG
W25Q32BVZPAP
W25Q32BVZEAG
W25Q32BVZEAP
W25Q32BVTCAG
W25Q32BVTCAP
25Q32BVSAG
25Q32BVSAP
25Q32BVFAG
25Q32BVFAP
25Q32BVAAG
25Q32BVAAP
25Q32BVAG
25Q32BVAP
25Q32BVAG
25Q32BVAP
25Q32BVCAG
25Q32BVCAP
Notes:
1. For WSON packages, the package type ZP and ZE are not used in the top side marking.
2. Package type ZE (WSON-8 8x6mm) is a special order package, please contact Winbond for
ordering information.
3. For Automotive Temperature parts, please contact Winbond for availability.
- 78 -