W25Q64CV Datasheet, PDF (78/79 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q64CV
10.1 Valid Part Numbers and Top Side Marking
The following table provides the valid part numbers for the W25Q64CV SpiFlash Memory. Please contact
Winbond for specific availability by density and package type. Winbond SpiFlash memories use an 12-digit
Product Number for ordering. However, due to limited space, the Top Side Marking on all packages use
an abbreviated 10-digit number.
Part Numbers for Industrial Temperature:
PACKAGE TYPE
SS
SOIC-8 208mil
SF
SOIC-16 300mil
DA
PDIP-8 300mil
ZP⁽¹⁾
WSON-8 6x5mm
ZE⁽¹⁾⁽²⁾
WSON-8 8x6mm
TC
TFBGA-24 8x6mm
DENSITY
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
PRODUCT NUMBER
W25Q64CVSSIG
W25Q64CVSSIP
W25Q64CVSFIG
W25Q64CVSFIP
W25Q64CVDAIG
W25Q64CVDAIP
W25Q64CVZPIG
W25Q64CVZPIP
W25Q64CVZEIG
W25Q64CVZEIP
W25Q64CVTCIG
W25Q64CVTCIP
TOP SIDE MARKING
25Q64CVSIG
25Q64CVSIP
25Q64CVFIG
25Q64CVFIP
25Q64CVAIG
25Q64CVAIP
25Q64CVIG
25Q64CVIP
25Q64CVIG
25Q64CVIP
25Q64CVCIG
25Q64CVCIP
Part Numbers for Automotive Temperature⁽³⁾:
PACKAGE TYPE DENSITY
PRODUCT NUMBER
TOP SIDE MARKING
SS
SOIC-8 208mil
SF
SOIC-16 300mil
DA
PDIP-8 300mil
ZP⁽¹⁾
WSON-8 6x5mm
ZE⁽¹⁾⁽²⁾
WSON-8 8x6mm
TC
TFBGA-24 8x6mm
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
64M-bit
W25Q64CVSSAG
W25Q64CVSSAP
W25Q64CVSFAG
W25Q64CVSFAP
W25Q64CVDAAG
W25Q64CVDAAP
W25Q64CVZPAG
W25Q64CVZPAP
W25Q64CVZEAG
W25Q64CVZEAP
W25Q64CVTCAG
W25Q64CVTCAP
25Q64CVSAG
25Q64CVSAP
25Q64CVFAG
25Q64CVFAP
25Q64CVAAG
25Q64CVAAP
25Q64CVAG
25Q64CVAP
25Q64CVAG
25Q64CVAP
25Q64CVCAG
25Q64CVCAP
Notes:
1. For WSON packages, the package type ZP and ZE are not used in the top side marking.
2. Package type ZE (WSON-8 8x6mm) is a special order package, please contact Winbond for ordering
information.
3. For Automotive Temperature parts, please contact Winbond for availability.
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