W25Q64CV Datasheet, PDF (4/79 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

W25Q64CV
7.2.38 Program Security Registers (42h) ......................................................................................61
7.2.39 Read Security Registers (48h) ...........................................................................................62
8. ELECTRICAL CHARACTERISTICS............................................................................................... 63
8.1 Absolute Maximum Ratings................................................................................................ 63
8.2 Operating Ranges............................................................................................................... 63
8.3 Power-up Timing and Write Inhibit Threshold .................................................................... 64
8.4 DC Electrical Characteristics .............................................................................................. 65
8.5 AC Measurement Conditions.............................................................................................. 66
8.6 AC Electrical Characteristics .............................................................................................. 67
8.7 AC Electrical Characteristics (cont’d) ................................................................................. 68
8.8 Serial Output Timing........................................................................................................... 69
8.9 Serial Input Timing.............................................................................................................. 69
8.10 /HOLD Timing..................................................................................................................... 69
8.11 /WP Timing......................................................................................................................... 69
9. PACKAGE SPECIFICATION .......................................................................................................... 70
9.1 8-Pin SOIC 208-mil (Package Code SS)............................................................................ 70
9.2 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 71
9.3 8-Pad WSON 6x5mm (Package Code ZP) ........................................................................ 72
9.4 8-Pad WSON 8x6mm (Package Code ZE) ........................................................................ 74
9.5 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 75
9.6 24-Ball TFBGA 8x6-mm (Package Code TC) .................................................................... 76
10. ORDERING INFORMATION .......................................................................................................... 77
10.1 Valid Part Numbers and Top Side Marking ........................................................................ 78
11. REVISION HISTORY...................................................................................................................... 79
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