W25Q64DW_12 Datasheet, PDF (77/82 Pages) Winbond – 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

8-Contact 6x5mm WSON Cont’d.
W25Q64DW
SYMBOL
M
N
P
Q
R
MILLIMETERS
Min
Nom Max
Min
SOLDER PATTERN
3.40
4.30
6.00
0.50
0.75
INCHES
Nom
0.134
0.169
0.236
0.020
0.026
Max
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid placement of
exposed PCB vias under the pad.
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Publication Release Date: September 18, 2012
Revision D