W536030P Datasheet, PDF (7/14 Pages) Winbond – VOICE & MELODY CONTROLLER

W536030P/060P/090P/120P
PAD Description, continued
SYMBOL
TEST
I/O
FUNCTION
I Test pad. Active high with internal pull low resistor.
ROSC
I
Connect resistor to VDD pad to generate speech or melody playing
clock source.
PWM1/DAC
O
While speech or melody is active, PWM1/DAC is speaker direct driving
output or DAC output controlled by voice output file.
PWM2
O
While speech or melody is active, PWM2 is another speaker direct
driving output.
ADDR
O External serial memory address write clock for voice extension.
CLK
O External serial memory address read clock for voice extension.
DATA
I/O External serial memory data in/out for voice extension.
VSS
I Chip ground.
VSSP
I Chip ground for PWM or DAC playing output.
VSSA (3)
I Chip ground. (W536090P/120P only)
VDD
I Power source.
VDDP
I Power source for PWM or DAC playing output.
VDDA (3)
I Power source. (W536090P/120P only)
Notes:
(3). VDDA, VSSA for W536090P/120P only. To sure chip operation properly, please bond all VDD, VDDA, VDDP, VSS, VSSA
and VSSP pads, and connect VSS, VSSP form chip external PCB circuit.
(4). When working at NMOS open drain mode, external pull high voltage can't higher than VDD to avoid leakage current.
5. ELECTRICAL CHARACTERISTICS
5.1 Absolute Maximum Ratings
PARAMETER
Supply Voltage to Ground Potential
RATING
-0.3 to +7.0
UNIT
V
Applied Input/Output Voltage
-0.3 to +7.0
V
Power Dissipation
120
mW
Ambient Operating Temperature
0 to +70
°C
Storage Temperature
-55 to +150
°C
Note: Exposure to conditions beyond those listed under Absolute Maximum Ratings may adversely affect the life and reliability
of the device.
Publication Release Date: May 21, 2003
-7-
Revision A4