W25Q40BL Datasheet, PDF (68/73 Pages) Winbond – 2.5V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI

10.2 8-Pin SOIC 208-mil (Package Code SS)
W25Q40BL
GAUGE PLANE
SYMBOL
A
A1
A2
b
C
D
D1
E
E1
e⁽²⁾
H
L
y
θ
MILLIMETERS
Min
1.75
0.05
1.70
0.35
0.19
5.18
5.13
5.18
5.13
7.70
0.50
---
0°
Nom
1.95
0.15
1.80
0.42
0.20
5.28
5.23
5.28
5.23
1.27 BSC.
7.90
0.65
---
---
Max
2.16
0.25
1.91
0.48
0.25
5.38
5.33
5.38
5.33
8.10
0.80
0.10
8°
Min
0.069
0.002
0.067
0.014
0.007
0.204
0.202
0.204
0.202
0.303
0.020
---
0°
INCHES
Nom
0.077
0.006
0.071
0.017
0.008
0.208
0.206
0.208
0.206
0.050 BSC.
0.311
0.026
---
---
Max
0.085
0.010
0.075
0.019
0.010
0.212
0.210
0.212
0.210
0.319
0.031
0.004
8°
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
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