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W25Q40BL Datasheet, PDF (67/73 Pages) Winbond – 2.5V 4M-BIT SERIAL FLASH MEMORY WITH DUAL AND QUAD SPI
10. PACKAGE SPECIFICATION
10.1 8-Pin SOIC 150-mil (Package Code SN)
8
5
W25Q40BL
c
E HE
1
4
D
L
0.25
θ
Y
SEATING PLANE
b
A
e
A1
GAUGE PLANE
SYMBOL
A
A1
b
c
E(3)
D(3)
e(2)
HE
Y(4)
L
θ
MILLIMETERS
Min
1.35
0.10
0.33
0.19
3.80
4.80
5.80
---
0.40
0°
1.27 BSC
Max
1.75
0.25
0.51
0.25
4.00
5.00
6.20
0.10
1.27
10°
INCHES
Min
Max
0.053
0.069
0.004
0.010
0.013
0.020
0.008
0.010
0.150
0.157
0.188
0.196
0.050 BSC
0.228
0.244
---
0.004
0.016
0.050
0°
10°
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
- 67 -
Publication Release Date: July 08, 2010
Preliminary - Revision B