W83783S_04 Datasheet, PDF (55/56 Pages) Winbond – Monitoring IC

W83783S
10. PACKAGE DIMENTIONS
(24-pin SOP)
24
13
1
Y
SEATING PLANE
E H_E
12
D
e
b
A
A1
c
L
O
0.25
Control demensions are in milmeters .
SYMBOL
A
A1
b
c
E
D
e
HE
Y
L
θ
DIMENSION IN MM
MIN.
MAX.
2.35
2.65
0.10
0.30
0.33
0.51
0.23
0.32
7.40
7.60
15.20 15.60
1.27 BSC
10.00 10.65
0.10
0.40 1.27
0
8
DIMENSION IN INCH
MIN.
MAX.
0.093 0.104
0.004 0.012
0.013 0.020
0.009 0.013
0.291 0.299
0.598
0.614
0.050 BSC
0.394
0.419
0.004
0.016 0.050
0
8
GAUGE PLANE
Headquarters
No. 4, Creation Rd. III
Science-Based Industrial Park
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
www: http://www.winbond.com.tw/
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
TLX: 16485 WINTPE
Winbond Electronics (H.K.) Ltd.
Rm. 803, World Trade Square, Tower II
123 Hoi Bun Rd., Kwun Tong
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
Winbond Electronics
(North America) Corp.
2730 Orchard Parkway
San Jose, CA 95134 U.S.A.
TEL: [phone]
FAX: [phone]
Please note that all data and specifications are subject to change without
notice. All the trademarks of products and companies mentioned in this data
sheet belong to their respective owners.
These products are not designed for use in life support appliances, devices, or
systems where malfunction of these products can reasonably be expected to
result in personal injury. Winbond customers using or selling these products
for use in such applications do so at their own risk and agree to fully indemnify
Winbond for any damages resulting from such improper use or sale.
- 53 -
Publication Release Date: Oct. 2004
Revision 1.1