W25X05CL Datasheet, PDF (47/51 Pages) Winbond – 2.5 / 3 / 3.3 V 512K / 1M / 2M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

8-Pad WSON 6x5mm Cont’d.
W25X05CL/10CL/20CL
SYMBOL
MILLIMETERS
MIN
TYP.
MAX
SOLDER PATTERN
M
―
3.40
―
N
―
4.30
―
P
―
6.00
―
Q
―
0.50
―
R
―
0.75
―
INCHES
MIN
TYP.
MAX
―
0.1338
―
―
0.1692
―
―
0.2360
―
―
0.0196
―
―
0.0255
―
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
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Publication Release Date: March 23, 2012
Revision B