W25X05CL Datasheet, PDF (3/51 Pages) Winbond – 2.5 / 3 / 3.3 V 512K / 1M / 2M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

W25X05CL/10CL/20CL
8.2.16 32KB Block Erase (52h) ............................................................................................... 26
8.2.17 Block Erase (D8h) ........................................................................................................27
8.2.18 Chip Erase (C7h or 60h)...............................................................................................28
8.2.19 Power-down (B9h)........................................................................................................29
8.2.20 Release Power-down / Device ID (ABh).......................................................................30
8.2.21 Read Manufacturer / Device ID (90h) ...........................................................................32
8.2.22 Read Manufacturer / Device ID Dual I/O (92h) .............................................................33
8.2.23 Read Unique ID Number (4Bh) ....................................................................................34
8.2.24 JEDEC ID (9Fh) ...........................................................................................................35
9. ELECTRICAL CHARACTERISTICS ......................................................................................36
9.1 Absolute Maximum Rating.........................................................................................36
9.2 Operating Ranges .....................................................................................................36
9.3 Power-up Timing and Write Inhibit Threshold.............................................................37
9.4 DC Electrical Characteristics .....................................................................................38
9.5 AC Measurement Conditions.....................................................................................39
9.6 AC Electrical Characteristics......................................................................................40
AC Electrical Characteristics (cont’d).....................................................................................41
9.7 Serial Output Timing..................................................................................................42
9.8 Serial Input Timing ....................................................................................................42
9.9 HOLD Timing ............................................................................................................42
9.10 WP Timing ................................................................................................................42
10. PACKAGE SPECIFICATION.................................................................................................43
10.1 8-Pin SOIC 150-mil (Package Code SN)....................................................................43
10.2 8-Pin VSOP8 150-mil (Package Code SV).................................................................44
10.3 8-Pin TSSOP8 173-mil (Package Code SD) ..............................................................45
10.4 8-Contact 6x5mm WSON (Package Code ZP)...........................................................46
8-Pad WSON 6x5mm Cont’d.................................................................................................47
10.5 8-Pad USON 2x3-mm (Package Code UX)................................................................48
11. ORDERING INFORMATION .................................................................................................49
11.1 Valid Part Numbers and Top Side Marking ................................................................50
12. REVISION HISTORY ............................................................................................................51
Publication Release Date: March 23, 2012
-3-
Revision B