W25X20CLUXIG-TR Datasheet, PDF (46/50 Pages) Winbond – 2M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

8-Pad WSON 6x5mm Cont’d.
W25X20CL
SYMBOL
M
N
P
Q
R
MILLIMETERS
MIN
TYP.
MAX
MIN
SOLDER PATTERN
―
3.40
―
―
―
4.30
―
―
―
6.00
―
―
―
0.50
―
―
―
0.75
―
―
INCHES
TYP.
0.1338
0.1692
0.2360
0.0196
0.0255
MAX
―
―
―
―
―
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. The metal pad area on the bottom center of the package is not connected to any internal electrical signals. It
can be left floating or connected to the device ground (GND pin). Avoid placement of exposed PCB vias under the
pad.
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Publication Release Date: August 06, 2015
Revision F