W25X20CLUXIG-TR Datasheet, PDF (43/50 Pages) Winbond – 2M-BIT SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL I/O SPI

10. PACKAGE SPECIFICATION
10.1 8-Pin SOIC 150-mil (Package Code SN)
W25X20CL
SYMBOL
A
A1
b
C
D
E
HE
e
L
y
∘
MILLIMETERS
Min
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.40
---
0°
Nom
1.60
0.15
0.41
0.20
4.85
3.90
6.00
1.27BSC
0.71
---
---
Max
1.75
0.25
0.51
0.25
5.00
4.00
6.20
1.27
0.10
10°
Min
0.053
0.004
0.013
0.0075
0.188
0.150
0.288
0.016
---
0°
INCHES
Nom
0.062
0.006
0.016
0.0078
0.190
0.153
0.236
0.050BSC
0.027
---
---
Max
0.069
0.010
0.020
0.0098
0.197
0.157
0.244
0.050
0.004
10°
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches.
- 43 -
Publication Release Date: August 06, 2015
Revision F