W55MID15 Datasheet, PDF (4/7 Pages) Winbond – MFIDWB TRANSPONDER

W55MID15
5. FUNCTIONAL DESCRIPTION
5.1 External Inductor Coupling Circuit
The external inductor coupling circuit is designed for 13.56MHz magnetic field resonance. The
coupled center frequency will depend on equivalent inductor of external PCB inductor and a paralleled
capacitor.
5.2 Voltage Regulator & System Power Supply
The voltage regulator generates the need of device power supply.
5.3 Power-On Control Circuit
System power-on control circuit initiates the device to get into initial state.
5.4 Demodulation Control Circuit
The demodulation control circuit demodulates the signal of command, which is magnetic field coupling
from W55MID50 MFID^WB Reader system.
5.5 System Clock Generator
The system clock generator generates the need of device system clock.
5.6 Bonding-ID Decoder
The memory array decoder circuit decodes the mapping location of memory array, which indicates by
external RS0, RS1, RS2, RS3, and RS4 the 3-state Bonding Finger (Winbond patented).
5.7 Multiple Bonding-ID Arrays
The multiple Bonding-IDs array provides total up to 243 different bonding-ID and 10bit in each ID.
5.8 Data Format and Framing Generator
The data format and framing generator is in charge of the entire bonding-ID and command data into a
Winbond defined MFID^WB tag format.
5.9 Modulation Control Circuit
The modulation control circuit modulates the Winbond defined MFID^WB transponder format into the
magnetic field resonation.
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