W55MID15 Datasheet, PDF (3/7 Pages) Winbond – MFIDWB TRANSPONDER

W55MID15
3. PAD DESCRIPTION
SYMBOL
NC
RS4
RS3
RS2
RS1
RS0
VSS
COIL0
COIL1
NC
VDD
PAD NO.
1
2
3
4
5
6
7
8
9
10
11
I/O
--
I
I
I
I
I
Ground
I/O
I/O
--
Power
FUNCTIONAL DESCRIPTION
Testing only, no connection
3-state bonding finger
3-state bonding finger
3-state bonding finger
3-state bonding finger
3-state bonding finger
Ground return path
Coupling energy input and customer-ID output
Coupling energy input and customer-ID output
Testing only, no connection
Power path
4. BLOCK DIAGRAM
External
Inductor
Coupling
Circuit
Detuning
Control
Circuit
Voltage
Regulator
& System
Power
Sl
Demodulation
Control
Circuit
Power-
On
Control
System
Clock
Generato
Bonding
ID
Decoder
Modulation
Control
Circuit
Data
Format &
Framing
Manchester
Coding
Multiple
Bonding-ID
Array
Publication Release Date: April 18, 2005
-3-
Revision A3