W25Q64FVZPIG Datasheet, PDF (4/88 Pages) Winbond – 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI

W25Q64FV
7.2.37 Program Security Registers (42h) ......................................................................................66
7.2.38 Read Security Registers (48h) ...........................................................................................67
7.2.39 Set Read Parameters (C0h) ...............................................................................................68
7.2.40 Burst Read with Wrap (0Ch)...............................................................................................69
7.2.41 Enable QPI (38h)................................................................................................................70
7.2.42 Disable QPI (FFh)...............................................................................................................71
7.2.43 Enable Reset (66h) and Reset (99h)..................................................................................72
8. ELECTRICAL CHARACTERISTICS............................................................................................... 73
8.1 Absolute Maximum Ratings................................................................................................ 73
8.2 Operating Ranges............................................................................................................... 73
8.3 Power-up Timing and Write Inhibit Threshold .................................................................... 74
8.4 DC Electrical Characteristics .............................................................................................. 75
8.5 AC Measurement Conditions.............................................................................................. 76
8.6 AC Electrical Characteristics .............................................................................................. 77
8.7 AC Electrical Characteristics (cont’d) ................................................................................. 78
8.8 Serial Output Timing........................................................................................................... 79
8.9 Serial Input Timing.............................................................................................................. 79
8.10 HOLD Timing...................................................................................................................... 79
8.11 WP Timing.......................................................................................................................... 79
9. PACKAGE SPECIFICATION .......................................................................................................... 80
9.1 8-Pin SOIC 208-mil (Package Code SS)............................................................................ 80
9.2 8-Pin PDIP 300-mil (Package Code DA) ............................................................................ 81
9.3 8-Pad WSON 6x5-mm (Package Code ZP)....................................................................... 82
9.4 8-Pad WSON 8x6-mm (Package Code ZE)....................................................................... 83
9.5 16-Pin SOIC 300-mil (Package Code SF) .......................................................................... 84
9.6 24-Ball TFBGA 8x6-mm (Package Code TC, 6x4 ball array)............................................. 85
10. ORDERING INFORMATION .......................................................................................................... 86
10.1 Valid Part Numbers and Top Side Marking ........................................................................ 87
11. REVISION HISTORY...................................................................................................................... 88
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