W25X10AL Datasheet, PDF (38/45 Pages) Winbond – 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X10AL, W25X20AL, W25X40AL, W25X80AL
12. PACKAGE SPECIFICATION
12.1 8-Pin SOIC 150-mil (Package Code SN)
SYMBOL
A
A1
A2
b
C
D(3)
E
E1(3)
e(2)
L
θ
CP
MILLIMETERS
MIN
TYP.
MAX
1.47
1.60
1.72
0.10
---
0.24
---
1.45
---
0.33
0.41
0.50
0.19
0.20
0.25
4.80
4.85
4.95
5.80
6.00
6.19
3.80
3.90
4.00
1.27 BSC
0.40
0.71
1.27
0o
---
8o
---
---
0.10
MIN
0.058
0.004
---
0.013
0.0075
0.189
0.228
0.150
0.015
0o
---
INCHES
TYP.
0.063
---
0.057
0.016
0.008
0.191
0.236
0.154
0.050 BSC
0.028
---
---
MAX
0.068
0.009
---
0.020
0.0098
0.195
0.244
0.157
0.050
8o
0.004
Notes:
1. Controlling dimensions: inches, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
package.
4. Formed leads shall be planar with respect to one another within .0004 inches at the seating plane.
- 38 -