W25X10AL Datasheet, PDF (3/45 Pages) Winbond – 1M-BIT, 2M-BIT, 4M-BIT AND 8M-BIT 2.5V SERIAL FLASH MEMORY WITH 4KB SECTORS AND DUAL OUTPUT SPI

W25X10AL, W25X20AL, W25X40AL, W25X80AL
10.2.6 Write Status Register (01h) ..........................................................................................18
10.2.7 Read Data (03h) ...........................................................................................................19
10.2.8 Fast Read (0Bh) ...........................................................................................................20
10.2.9 Fast Read Dual Output (3Bh) .......................................................................................21
10.2.10 Page Program (02h) ...................................................................................................22
10.2.11 Sector Erase (20h) .....................................................................................................23
10.2.12 Block Erase (D8h) ......................................................................................................24
10.2.13 Chip Erase (C7h)........................................................................................................25
10.2.14 Power-down (B9h) ......................................................................................................26
10.2.15 Release Power-down / Device ID (ABh) .....................................................................27
10.2.16 Read Manufacturer / Device ID (90h) .........................................................................29
10.2.17 JEDEC ID (9Fh)..........................................................................................................30
11. ELECTRICAL CHARACTERISTICS......................................................................................... 31
11.1 Absolute Maximum Ratings .......................................................................................... 31
11.2 Operating Ranges......................................................................................................... 31
11.3 Endurance and Data Retention .................................................................................... 32
11.4 Power-up Timing and Write Inhibit Threshold .............................................................. 32
11.5 DC Electrical Characteristics ........................................................................................ 33
11.6 AC Measurement Conditions........................................................................................ 34
11.7 AC Electrical Characteristics ........................................................................................ 35
11.8 AC Electrical Characteristics (cont’d) ........................................................................... 36
11.9 Serial Output Timing ..................................................................................................... 37
11.10 Input Timing................................................................................................................. 37
11.11 Hold Timing ................................................................................................................. 37
12. PACKAGE SPECIFICATION .................................................................................................... 38
12.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 38
12.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 39
12.3 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 40
12.4 8-Pad WSON 6x5mm (Package Code ZP) .................................................................. 41
12.5 8-Pad WSON 6x5mm Cont’d........................................................................................ 42
13. ORDERING INFORMATION .................................................................................................... 43
14. REVISION HISTORY ................................................................................................................ 45
Publication Release Date: May 9, 2008
-3-
Revision B