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W39V040B Datasheet, PDF (32/32 Pages) Winbond – 512K × 8 CMOS FLASH MEMORY WITH LPC INTERFACE
W39V040B
17. VERSION HISTORY
VERSION
A1
DATE
Nov. 26, 2004
A2
Jan.25, 2005
A3
April 14, 2005
PAGE
-
P8, P9, P10
P32
DESCRIPTION
Initial Issued
Delete 7.3 ~ 7.7 item
Block lock relate description
Add important notice
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipment
intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation
instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or
sustain life. Further more, Winbond products are not intended for applications wherein failure of Winbond products
could result or lead to a situation wherein personal injury, death or severe property or environmental damage could
occur.
Winbond customers using or selling these products for use in such applications do so at their own risk and agree to
fully indemnify Winbond for any damages resulting from such improper use or sales.
Headquarters
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5665577
http://www.winbond.com.tw/
Winbond Electronics Corporation America
2727 North First Street, San Jose,
CA 95134, U.S.A.
TEL: 1-408-9436666
FAX: 1-408-5441798
Winbond Electronics (Shanghai) Ltd.
27F, 2299 Yan An W. Rd. Shanghai,
200336 China
TEL: 86-21-62365999
FAX: 86-21-62365998
Taipei Office
9F, No.480, Rueiguang Rd.,
Neihu District, Taipei, 114,
Taiwan, R.O.C.
TEL: 886-2-8177-7168
FAX: 886-2-8751-3579
Winbond Electronics Corporation Japan
7F Daini-ueno BLDG, 3-7-18
Shinyokohama Kohoku-ku,
Yokohama, 222-0033
TEL: 81-45-4781881
FAX: 81-45-4781800
Winbond Electronics (H.K.) Ltd.
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd.,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
Please note that all data and specifications are subject to change without notice.
All the trade marks of products and companies mentioned in this data sheet belong to their respective owners.
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Publication Release Date: April 14, 2005
Revision A3