W78LE58_06 Datasheet, PDF (27/34 Pages) Winbond – 8-BIT MICROCONTROLLER

W78LE58/W78L058A
12. PACKAGE DIMENSIONS
40-pin DIP
40
E1
1
S
A A2
L
D
B
e1
B1
21
20
E
A1
Base Plane
Seating Plane
a
eA
Symbol ^{Dimension in inch Dimension in mm}
Min. Nom. Max. Min. Nom. Max.
A
0.210
5.334
A1
0.010
0.254
A2
0.150 0.155 0.160 3.81 3.937 4.064
B
0.016 0.018 0.022 0.406 0.457 0.559
B1
0.048 0.050 0.054 1.219 1.27 1.372
c
0.008 0.010 0.014 0.203 0.254 0.356
D
2.055 2.070
52.20 52.58
E
0.590 0.600 0.610 14.986 15.24 15.494
E1
0.540 0.545 0.550 13.72 13.84 13.97
e1
0.090 0.100 0.110 2.286 2.54 2.794
L
0.120 0.130 0.140 3.048 3.302 3.556
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.01
S
0.090
2.286
Notes:
1. Dimension D Max. & S include mold flash or
c
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mo.ld parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
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Publication Release Date: December 4, 2006
Revision A6