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W78LE54 Datasheet, PDF (22/22 Pages) Winbond – 8-BIT MTP MICROCONTROLLER
Preliminary W78LE54
Package Dimensions, continued
44-pin PQFP
44
1
HD
D
34
11
12
e
b 22
33
E HE
Seating Plane See Detail F
A2 A
A1
y
c
θ
L
L1
Detail F
Dimension in inch
Dimension in mm
Symbol Min. Nom. Max. Min. Nom. Max.
A
---
---
---
---
---
---
A1
0.002 0.01 0.02 0.05 0.25 0.5
A2
0.075 0.081 0.087 1.90 2.05 2.20
b
0.01 0.014 0.018 0.25 0.35 0.45
c
0.004 0.006 0.010 0.101 0.152 0.254
D
0.390 0.394 0.398 9.9 10.00 10.1
E
0.390 0.394 0.398 9.9 10.00 10.1
e
0.025 0.031 0.036 0.635 0.80 0.952
HD
0.510 0.520 0.530 12.95 13.2 13.45
HE
0.510 0.520 0.530 12.95 13.2 13.45
L
0.025 0.031 0.037 0.65 0.8 0.95
L1
0.051 0.063 0.075 1.295 1.6 1.905
y
0.003
0.08
θ
0
7
0
7
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b does not include dambar
protrusion/intrusion.
3. Controlling dimension: Millimeter
4. General appearance spec. should be based
on final visual inspection spec.
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: 886-3-5770066
FAX: 886-3-5792766
Rm. 803, World Trade Square, Tower II,
123 Hoi Bun Rd., Kwun Tong,
Kowloon, Hong Kong
TEL: 852-27513100
FAX: 852-27552064
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: 886-2-27190505
FAX: 886-2-27197502
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: 408-9436666
FAX: 408-5441798
Note: All data and specifications are subject to change without notice.
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