W86L387D Datasheet, PDF (16/25 Pages) Winbond – Winbond Host Interface Memory StickTM Bridge

W86L387D
8. ELECTRICAL CHARACTERISTICS
8.1 Maximum Ratings*
PRELIMINARY
Parameter
1 Supply Voltage with respect to V_VSS
2 Current at any pin other than supplies
3 Storage Temperature
* Exceeding these values may cause permanent damage.
Symbol
V_VDD
Tst
Rating
-0.3 to 6
0 to 10
-65 to 150
Units
V
mA
℃
8.2 Recommended Operating Conditions
Characteristics
Symbol
1 Operation Voltage (referenced to VSS pin).
2 Operation Voltage (referenced to VSS pin)
(Note)
V_VDD
V_VDD
3 Clock Frequency at XTI pin
fXTL
4 Operation Temperature
Top
Note: Clock frequency not guaranteed up to 20MHz.
Rating
3.0 to 3.6
2.7to 3.0
20
0 to 70
Unit
V
V
MHz
℃
8.3 Power Supply Characteristics
Parameter
Condition Symbol Min _Typ‡ Max Units Test
1 Standby Supply Current
2 Operating Supply Current
Power Supply
(V_VDD = 3.3V)
IQ
IVDD
2
10 uA Test 1
4.7
6
mA Test 2
3 Operating Supply Current
IVDD
3.5
mA Test 3
‡: Typical figure are at V_DIVDD = 3.3V and temperature = 25 ℃ and are for design aid only, not
guaranteed and not subject to production testing.
Test 1: All input pins are V_VDD or V_VSS, configured as power down mode, output without
loading and no clock input on the XTI and HCKI pins.
Test 2: 20 MHz external clock input on the XTI pin, output without loading.
Test 3: 20 MHz crystal connected at XTI and XTO pins, output without loading.
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Publication Release Date: July 2001
Revision 0.50