W78C32C Datasheet, PDF (13/14 Pages) Winbond – 8-BIT MICROCONTROLLER

PACKAGE DIMENSIONS
40-pin DIP
40
E1
1
S
A A2
L
D
B
e1
B1
W78C32C
21
20
E
A1
Base Plane
Seating Plane
a
eA
Symbol ^{Dimension in inch Dimension in mm}
Min. Nom. Max. Min. Nom. Max.
A
0.210
5.334
A1
0.010
0.254
A2
0.150 0.155 0.160 3.81 3.937 4.064
B
0.016 0.018 0.022 0.406 0.457 0.559
B1
0.048 0.050 0.054 1.219 1.27 1.372
c
0.008 0.010 0.014 0.203 0.254 0.356
D
2.055 2.070
52.20 52.58
E
0.590 0.600 0.610 14.986 15.24 15.494
E1
0.540 0.545 0.550 13.72 13.84 13.97
e1
0.090 0.100 0.110 2.286 2.54 2.794
L
0.120 0.130 0.140 3.048 3.302 3.556
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.01
S
0.090
2.286
Notes:
1. Dimension D Max. & S include mold flash or
c
tie bar burrs.
2. Dimension E1 does not include interlead flash.
3. Dimension D & E1 include mold mismatch and
are determined at the mold. parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
44-pin PLCC
6
7
HD
D
1 44
40
39
E
HE
17
18
29
28
L
θ
Seating Plane
e
b
b1
GD
A2 _A
A1
y
GE
c
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
Dimension in inch Dimension in mm
Min. Nom. Max. Min. Nom. Max.
0.185
4.699
0.020
0.508
0.145 0.150 0.155 3.683 3.81 3.937
0.026 0.028 0.032 0.66 0.711 0.813
0.016 0.018 0.022 0.406 0.457 0.559
0.008 0.010 0.014 0.203 0.254 0.356
0.648 0.653 0.658 16.46 16.59 16.71
0.648 0.653 0.658 16.46 16.59 16.71
0.050 BSC
1.27 BSC
0.590 0.610 0.630 14.99 15.49 16.00
0.590 0.610 0.630 14.99 15.49 16.00
0.680 0.690 0.700 17.27 17.53 17.78
0.680 0.690 0.700 17.27 17.53 17.78
0.090 0.100 0.110 2.296 2.54 2.794
0.004
0.10
Notes:
1. Dimension D & E do not include interlead
flash.
2. Dimension b1 does not include dambar
protrusion/intrusion.
3. Controlling dimension: Inches
4. General appearance spec. should be based
on final visual inspection spec.
- 13 -
Publication Release Date: July 1999
Revision A2