W27E020 Datasheet, PDF (13/14 Pages) Winbond – 256K X 8 ELECTRICALLY ERASABLE EPROM

Preliminary W27E020
PACKAGE DIMENSIONS
32-pin P-DIP
32
E1
1
S
2
AA
L
D
17
B
e1
B1
16
E
1
A Base Plane
Seating Plane
a
eA
32-Lead PLCC
4
5
HE
E
1 32
30
29
D
DH
13
14
21
20
L
θ
Seating Plane
e
b
b1
GE
2
AA
1
A
y
GD
c
Symbol
A
A1
Dimension in Inches
Min. Nom. Max.
0.210
0.010
Dimension in mm
Min. Nom. Max.
5.33
0.25
A 2 ^{0.150 0.155 0.160} 3.81 3.94 4.06
B
0.016 0.018 0.022 0.41 0.46 0.56
B 1 0.048 ^0.050 0.054 ^{1.22 1.27 1.37}
c
0.008 0.010 0.014 0.20 0.25 0.36
D
1.650 1.660
41.91 42.16
E
0.590 0.600 0.610 14.99 15.24 15.49
E1
0.540 0.550 0.555 13.84 13.97 14.10
e1
0.090 0.100 0.110 2.29 2.54 2.79
L
0.120 0.130 0.140 3.05 3.30 3.56
a
0
15
0
15
eA
0.630 0.650 0.670 16.00 16.51 17.02
S
0.085
2.16
Notes:
1. Dimensions D Max. & S include mold flash or
tie bar burrs.
2. Dimension E1 does not include interlead flash.
c
3. Dimensions D & E1 include mold mismatch and
are determined at the mold parting line.
4. Dimension B1 does not include dambar
protrusion/intrusion.
5. Controlling dimension: Inches.
6. General appearance spec. should be based on
final visual inspection spec.
Symbol
A
A1
A2
b1
b
c
D
E
e
GD
GE
HD
HE
L
y
θ
Dimension in Inches
Dimension in mm
Min. Nom. Max. Min. Nom. Max.
0.140
3.56
0.020
0.50
0.105 0.110 0.115 2.67
2.80
2.93
0.026 0.028 0.032 0.66
0.71
0.81
0.016 0.018 0.022 0.41
0.46
0.56
0.008 0.010 0.014 0.20
0.25
0.35
0.547
0.447
0.044
0.550
0.450
0.050
0.553
0.453
0.056
13.89
11.35
1.12
13.97
11.43
1.27
14.05
11.51
1.42
0.490
0.390
0.585
0.485
0.510
0.410
0.590
0.490
0.530
0.430
0.595
0.495
12.45
9.91
14.86
12.32
12.95
10.41
14.99
12.45
13.46
10.92
15.11
12.57
0.075 0.090 0.095 1.91
2.29
2.41
0.004
0°
10°
0°
0.10
10°
Notes:
1. Dimensions D & E do not include interlead flash.
2. Dimension b does not include dambar protrusion/intrusion.
3. Controlling dimension: Inches.
4. General appearance spec. should be based onfinal
visual inspection sepc.
- 13 -
Publication Release Date: December 1997
Revision A1