W24257 Datasheet, PDF (10/10 Pages) Winbond – 32K X 8 CMOS STATIC RAM

W24257
VERSION HISTORY
VERSION
A12
DATE
Nov. 1999
A13
Apr. 2000
A14
May 2000
A15
Nov. 2000
A16
Feb. 2001
PAGE
1, 2, 7
4, 7
7
1, 7, 8
8
2
1
2, 4, 7
DESCRIPTION
Change the IDD, ISB, ISB1
Remove the W24257-10 spc.
Typo correction in Standby Current Max.: mA->µA
Delete 28-pin DIP Package
Add in Bonding Pad Diagram
Modify Operating Power Supply Current (IDD) as 70 mA
Add in TSOP Pin Configuration
Add in LE grade
Headquarters
Winbond Electronics (H.K.) Ltd.
No. 4, Creation Rd. III,
Science-Based Industrial Park,
Hsinchu, Taiwan
TEL: [phone]
FAX: [phone]
Unit 9-15, 22F, Millennium City,
No. 378 Kwun Tong Rd;
Kowloon, Hong Kong
TEL: [phone]
FAX: [phone]
http://www.winbond.com.tw/
Voice & Fax-on-demand: 886-2-27197006
Taipei Office
11F, No. 115, Sec. 3, Min-Sheng East Rd.,
Taipei, Taiwan
TEL: [phone]
FAX: [phone]
Winbond Electronics North America Corp.
Winbond Memory Lab.
Winbond Microelectronics Corp.
Winbond Systems Lab.
2727 N. First Street, San Jose,
CA 95134, U.S.A.
TEL: [phone]
FAX: [phone]
Note: All data and specifications are subject to change withou t notice.
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